MAR 2-05 CO:R:C:V 732357 pmh

Mr. Tom Allen
Kintetsu Intermodal USA, Inc.
P.O. Box 30355
Portland, OR 97230

RE: Country of origin marking requirements for integrated circuits manufactured in the U.S., Korea and Hong Kong

Dear Mr. Allen:

This is in response to your April 10, 1989 letter on behalf of your client, Sharp Microelectronics Technology, Inc. (the importer) requesting a ruling on the country of origin marking requirements for integrated circuits that are manufactured in the U.S., Korea and Hong Kong, using silicon wafers manufactured in Japan. We regret the delay in responding to your request.

FACTS:

According to your letter, your client imports silicon wafers manufactured by the Sharp Corporation in Japan. The Sharp Corporation plans on distributing the silicon wafers to various assembly plants in Korea, Hong Kong and the U.S. At the assembly plants, the silicon wafers will be cut into integrated circuit- size pieces which are mounted to the leadframe by eutectic or epoxy mechanisms. Gold or aluminum wires are then attached to the circuit and to the leadframe by means of ultrasonic or thermionic bonding. The leadframe and circuit are finally encapsulated and the finished circuits are packed.

ISSUE:

For marking purposes, what is the country of origin of finished integrated circuits that are assembled in Hong Kong, Korea or the U.S. from silicon wafers manufactured in Japan, and other materials.

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LAW AND ANALYSIS:

Section 304 of the Tariff Act of 1930, as amended (19 U.S.C.), provides that unless excepted, every article of foreign origin imported into the U.S. shall be marked in a conspicuous place as legibly, indelibly, and permanently as the nature of the article (or container) will permit, in such a manner as to indicate to the ultimate purchaser in the U.S. the English name of the country of origin of the article.

Part 134, Customs Regulations (19 CFR Part 134), implements the country of origin marking requirements and exceptions of 19 U.S.C. 1304. Section 134.1(b), Customs Regulations (19 CFR 134.1(b)), defines the country of origin of an article as the country of manufacture, production, or growth of any article of foreign origin entering the U.S. Further work or material added to an article in another country must effect a substantial transformation in order to render such other country the country of origin for marking purposes.

To constitute a substantial transformation, a new and different article of commerce having a new name, character or use must emerge from the processing. See United States v. Gibsen- Thomsen Co. Inc., 27 C.C.P.A. 267, C.A.D. 98 (1940). In addition, factors such as complexity and cost of the processing operations and whether the essence of the article has been changed, have also been considered. See Uniroyal Inc. v. United States, 3 C.I.T. 220, 542 F. Supp. 1026 (1982), aff'd, 702 F.2d 1022 (Fed.Cir. 1983).

In a ruling published as C.S.D. 80-227, dated February 13, 1980, Customs determined that assembly of integrated circuits from imported silicon semiconductor chips, and which included attachment of the die and lead wires, and encapsulation effected a substantial transformation. Customs reasoned that the silicon semiconductor chips and other materials were of no functional use in their original state before they were assembled in the finished integrated circuit and that "the use, character, name and value of a finished integrated circuit is substantially different from a semiconductor chip."

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Likewise in this case, the processing of the Japanese silicon wafers into integrated circuits, which includes cutting the wafers into chips, mounting the individual circuit by eutectic or epoxy mechanisms to the leadframe, bonding of gold and aluminum wires to circuit and leadframe and encapsulation of leadframe and circuit is the same as that described in C.S.D. 80- 227. Indeed, the processing in this case includes the additional step of cutting the silicon wafers into integrated circuit-size chips. Consequently, we find that the silicon wafers are substantially transformed by the processing that occurs in either Korea, Hong Kong or the U.S. The finished integrated circuits are products of the country in which such processing occurs.

Those integrated circuits that are products of either Hong Kong or Korea, should be marked accordingly at the time they are imported into the U.S. Such marking must be in compliance with the requirements of 19 U.S.C. 1304 and 19 CFR Part 134. Those integrated circuits that are produced in the U.S. are not subject to the requirements of 19 U.S.C. 1304 and 19 CFR Part 134.

We note, however, that the silicon wafers that are imported for use in the manufacture of the U.S. integrated circuits must be marked to indicate the country of origin to the ultimate purchaser in the U.S. Section 134.35, Customs Regulations (19 CFR 134.35), provides that if an imported article will be used in manufacture, the manufacturer is the ultimate purchaser if he subjects the imported article to a process which results in a substantial transformation. In such circumstances, the imported article is excepted from individual marking; it is sufficient to mark the bulk container in which they are imported. Since the U.S. manufacturing operations described above result in a substantial transformation of the silicon wafers, it is acceptable to mark the bulk container in which the silicon wafers are imported.

HOLDING:

The assembly of integrated circuits using imported silicon wafers and which consists of cutting the wafers into chips, mounting the individual circuit to the leadframe, bonding gold or

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aluminum wire to the leadframe and encapsulating the leadframe and circuit constitutes a substantial transformation. The finished integrated circuit is considered to be a product of the country in which such processing occurs and should be marked accordingly, in compliance with the requirements of 19 U.S.C. 1304.

Sincerely,

Marvin M. Amernick
Chief, Value, Special Programs
and Admissibility Branch