In order for a covered entity to qualify for financial assistance under this section, the covered entity shall demonstrate to the Secretary, in the application submitted by the covered entity under subparagraph (A), that—
(ii)
with respect to the project described in clause (i), the covered entity has—
(I)
been offered a covered incentive;
(II)
made commitments to worker and community investment, including through—
(aa)
training and education benefits paid by the covered entity; and
(bb)
programs to expand employment opportunity for economically disadvantaged individuals; and
(III)
secured commitments from regional educational and training entities and institutions of higher education to provide workforce training, including programming for training and job placement of economically disadvantaged individuals;
(IV)
an executable plan to sustain the facility described in clause (i) without additional Federal financial assistance under this subsection for facility support;
(V)
determined—
(aa)
the type of semiconductor technology, equipment, materials, or research and development the covered entity will produce at the facility described in clause (i); and
(bb)
the customers, or categories of customers, to which the covered entity plans to sell the semiconductor technology, equipment, materials, or research and development described in item (aa); and
(VI)
documented, to the extent practicable, workforce needs and developed a strategy to meet such workforce needs consistent with the commitments described in subclauses (II) and (III);
(iii)
with respect to the project described in clause (i), the covered entity has an executable plan to identify and mitigate relevant semiconductor supply chain security risks, such as risks associated with access, availability, confidentiality, integrity, and a lack of geographic diversification in the covered entity’s supply chain; and
(iv)
with respect to any project for the production, assembly, or packaging of semiconductors, the covered entity has implemented policies and procedures to combat cloning, counterfeiting, and relabeling of semiconductors, as applicable.