Regulations last checked for updates: Feb 21, 2025

Title 40 - Protection of Environment last revised: Nov 21, 2025
All TitlesTitle 40Chapter IPart 98Subpart IAppendix - Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
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Appendix - Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type Process gas i
CF4 C2F6 CHF3 CH2F2 C2HF5 CH3F C3F8 C4F8 NF3 SF6 C4F6 C5F8 C4F8O
Etching/Wafer Cleaning
1-Ui0.730.460.310.370.0640.66NA0.210.200.550.0860.072NA
BCF4NA0.200.100.0310.077NANA0.170.00400.0230.0089NANA
BC2F60.029NANANANANANA0.065NANA0.0450.014NA
BC4F6NANANANANANANANANANANANANA
BC4F8NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
BC5F8NANANANANANANA0.016NANANANANA
BCHF30.13NANANANANANANANANANA0.0039NA
Chamber Cleaning
In situ plasma cleaning
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.19NANANANA0.200.110.14NANANA0.13
BC2F6NANANANANANANANANANANANA0.045
BC3F8NANANANANANANANANANANANANA
Remote plasma cleaning
1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
In situ thermal cleaning
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
[89 FR 31923, Apr. 25, 2024]
authority: 42 U.S.C. 7401-7671q.
source: 74 FR 56374, Oct. 30, 2009, unless otherwise noted.
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