Regulations last checked for updates: Feb 21, 2025

Title 40 - Protection of Environment last revised: Nov 21, 2025
Appendix - Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type Process gas i
CF4 C2F6 CHF3 CH2F2 C2HF5 CH3F C3F8 C4F8 NF3 SF6 C4F6 C5F8 C4F8O
Etching/Wafer Cleaning
1-Ui0.730.720.510.130.0640.70NA0.140.190.550.0830.072NA
BCF4NA0.100.0850.0790.077NANA0.110.00400.130.095NANA
BC2F60.041NA0.0350.0250.0240.0034NA0.0370.0250.110.0730.014NA
BC4F8NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
BCHF30.0910.047NA0.049NANANA0.040NA0.00120.0660.0039NA
Chamber Cleaning
In situ plasma cleaning
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.19NANANANA0.200.110.14NANANA0.13
BC2F6NANANANANANANANANANANANA0.045
BC3F8NANANANANANANANANANANANANA
Remote plasma cleaning
1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
BF2NANANANANANANANA0.5NANANANA
In situ thermal cleaning
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31920, Apr. 25, 2024]
source: 74 FR 56374, Oct. 30, 2009, unless otherwise noted.