The provisions of this subpart are applicable to discharges resulting from all process operations associated with the manufacture of semiconductors, except sputtering, vapor deposition, and electroplating.
authority: Secs. 301, 304, 306, 307, 308, and 501 of the Clean Water Act (the Federal Water Pollution Control Act Amendments of 1972, as amended by the Clean Water Act of 1977,
33 U.S.C. 1311,
1314,
1316,
1317,
1318,
and; 86 Stat. 816, Pub. L. 92-500; 91 Stat. 1567, Pub. L. 95-217, unless otherwise noted
source: 48 FR 15394, Apr. 8, 1983, unless otherwise noted.
cite as: 40 CFR 469.10